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Amphenol Amphenol connector-Amphenol high-speed backplane connector Paladin series products mainly include two types/categories; They are: Paladin ® HD 112G backplane interconnect system, Paladin ® 112Gb/s backplane connector; Its Paladin ® HD 112G backplane interconnection system is a high-speed backplane connector with high density, data rate of 112GB/s, high bandwidth and up to 144 quadrature differential pairs in 1U space; The Paladin ® 112Gb/s backplane connector is a: Employing Amphenol's disruptive 112Gb/s backplane interconnect technology Paladin's ® 's innovative architecture sets the benchmark for signal integrity in backplane interconnect systems. This series of connectors has smooth linear transmission bandwidth of more than 40GHz, extremely low crosstalk, and maintains consistent signal integrity across the entire mating product family.
----------------------------------------------------------------------------1. Amphenol High Speed Backplane Connector Paladin ® HD 112G Backplane Interconnection System Product Details, Features and Advantages:
| Characteristic | Advantage |
| Excellent orthogonal density | Supports 144 differential pairs in 1RU card space to ensure air circulation |
| Industry Standard Performance of 112G Systems | XTalk margin exceeds 40dB when accounting for insertion loss (IL) at 25GHz |
| Linear transmission bandwidth exceeds 40GHz | No residual pile resonance at 40GHz |
| Hybrid plate fixing mechanism with crimp ground terminal and crimp signal to support conventional manufacturing process | Optimization is carried out for the maximum line differential pair density, signal integrity and differential pair routing on the top layer of the board |
| Can accommodate more routing channels to reduce the number of layers as much as possible | Supports 144 orthogonal differential pairs, can be routed in 6 high-speed layers, with up to 2 differential pairs per layer |
| Consistent signal integrity throughout the mechanical fitting range of the connector | The impedance variation is less than 5 Ω when the unplugged connector length reaches 1.5 mm |
| Mechanically matched and electrically balanced signals are employed within each differential pair | Adopts low-lag design, supports low-mode conversion and traditional routing splitting |
| Universal symmetrical matching interface | Supports 90 °/270 ° orthogonal applications, as well as male and female cables |
| Utilize the mature Paladin differential pair architecture and matching interface | Optimized reliability, robustness, quality for real-world 112G applications |
| 92 Ω (+/-5 Ω) nominal impedance | Future upgrades under design |
Optimized Density and Performance: Paladin ® The HD interconnect system has high density, supports a data rate of 112GB/s, provides high bandwidth, and supports up to 144 orthogonal differential pairs in 1U space. Paladin HD employs a balanced pair structure; Using separately assembled and discrete shielded differential pairs, equipped with a disruptive hybrid plate fixing mechanism, high-density transmission can be achieved. The matching interface is designed to optimize space and avoid traditional orthogonal "twists". Paladin Several versions of the HD feature a universal matching interface to support quadrature and cable applications. Excellent bandwidth: supports 144 orthogonal differential pairs in 1RU space and supports a data rate of 112GB/s; Excellent transmission crosstalk performance; Equipped with a disruptive hybrid board fixing mechanism to support flexible on-board wiring; 1.5 mm connector with impedance control when unplugged; discrete shielded and balanced differential pairs; Universal matching interface.
---------------------------------------------------------------------------------2. Amphenol High Speed Backplane Connector Paladin ® 112Gb/s Backplane Connector Product Details, Features and Advantages:
| Characteristic | Advantage |
| 95 ohm nominal impedance | Impedance variation range ± 5 ohms |
| Industry-leading signal-to-noise ratio performance | The difference between insertion loss (IL) and crosstalk (XT) exceeds 40dB at 25GHz |
| Linear transmission bandwidth exceeds 40GHz | Signal contact does not produce residual pile resonance |
| Highly isolated and symmetrical packaging | Best-in-class crosstalk and common-mode conversion performance with 40GHz bandwidth |
| The two signal pins within each differential pair are equal in mechanical and electrical length | Using low time lag design, it can avoid the wiring problems of board-end coupling architecture |
| Consistent signal integrity throughout the slide range of the connector | When the unplugged length of the connector reaches 2 mm, the impedance variation is less than 5 ohms |
| Common interface and optimized square pitch | Extensive product range to support traditional backplane, direct orthogonal, cable, coplanar and parallel snap applications |
| Extensive product range to support traditional backplane, direct orthogonal, cable, coplanar and parallel snap applications | Dual-track cabling reduces the number of layers of the board and reduces system costs |
Employing Amphenol's disruptive 112Gb/s backplane interconnect technology; Paladin's ® 's innovative architecture sets the benchmark for signal integrity in backplane interconnect systems. This series of connectors has smooth linear transmission bandwidth of more than 40GHz, extremely low crosstalk, and maintains consistent signal integrity across the entire mating product family. Paladin's ® uses breakthrough technologies that enable customers to design complex systems to support today's data rates and provide room for upgrades for future performance requirements. The Paladin ® adopts a minimalist connector structure for higher scalability and flexibility. This is a super extensive connector product platform that supports traditional backplanes, cable backplanes, and more than 100 direct orthogonal configurations.
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