Categorization：Product Information
Amphenol Amphenol connector-Amphenol high-speed backplane connector Elite series products are: ultra-high density backplane interconnection solution; Ultra-high density 56 + Gbp/s PAM4 interconnect platform with proven crimping technology and a single Wafer design optimized for traditional backplane, direct orthogonal and cable design solutions. Having integrated guiding functions greatly reduces valuable PCB edge space while providing strong protection and fit for today's demanding card designs.
---------------------------------------------------------------------1. Amphenol High Speed Backplane Connector--Elite Series Backplane Connector Product Details, Features and Advantages:
| Characteristic | Advantage |
| 56 Gb/s PAM4 | Support emerging data center performance needs |
| 90 ohm nominal impedance | +/-5 ohm impedance variation up to 1 mm attenuation |
| 2mm Signal Pin Wipe | The polarity-free interface greatly reduces electrical stump while maintaining a high degree of reliability in the redundant contact system |
| 15.7 Mil Drill Crimp Pin | Time-tested crimping technology that allows PCB back drilling and packaging, supports 40 GHz bandwidth |
| high density | Can support 8 differential pairs in 1RU and up to 144 differential pairs in direct orthogonal scheme |
| RAF side pitch 3 x 3.25 mm | Supports 2 differential pairs of routing to reduce PCB complexity and cost |
| Each differential pair matching beam has grounding structure on all four sides | Higher signal isolation performance |
| Universal mating interface for cable, standard header or direct orthogonal configuration | Seamless system design for flexibility |
| Die casting guide die | Powerful guiding features integrated into connector design, allowing X-axis +/-1.8 mm, Y-axis +/-2.0 mm gathering |
Ultra-high density backplane interconnect scheme; Ultra-high density 56 + Gbp/s PAM4 interconnect platform with proven crimping technology and a single Wafer design optimized for traditional backplane, direct orthogonal and cable design solutions. Impedance control performance up to 1 mm attenuation; Each differential pair is 360 degrees shielded; Optimizing packaging for double differential pair routing; The single Wafer design is scalable to accommodate multiple applications; Integrated guide capabilities dramatically reduce valuable PCB edge space while providing strong protection and fit for today's demanding card designs.
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