Categorization：Product Information
Amphenol Amphenol Connector-Amphenol chip socket-to-board stacked connector cLGA ® series products are: Amphenol cLGA ® planar grid array package socket system is designed to integrate traditional connectors Material structures are introduced into high-performance, low-cost chip-to-board applications. Gold-nickel-copper alloy reed contacts guarantee long-term connector performance, contact retention and durability. The cLGA ® socket is widely used in many fields such as portable computer products and supercomputer systems. The cLGA ® socket is fully compliant with the Telcordia GR-1217-CORE specification. The cLGA ® technology can also be used as a cStack ™ board-to-board or flex circuit-to-board stacking connector. With low cost, high signal integrity, and no soldering, the cStack ™ replaces standard two-piece connectors in the above product applications.
-------------------------------------------------------------------------1. Amphenol Amphenol Connector--Chip socket to board stacked connector cLGA ® series product details and features and model/material number: high-performance, low-cost chip-to-board applications; Amphenol cLGA ® planar grid array package socket system aims to introduce traditional connector material structures into high-performance, low-cost chip-to-board applications. Gold-nickel-copper alloy reed contacts guarantee long-term connector performance, contact retention and durability. The cLGA ® socket is widely used in many fields such as portable computer products and supercomputer systems. The cLGA ® socket is fully compliant with the Telcordia GR-1217-CORE specification. The cLGA ® technology can also be used as a cStack ™ board-to-board or flex circuit-to-board stacking connector. With low cost, high signal integrity, and no soldering, the cStack ™ replaces standard two-piece connectors in the above product applications. Data rate: 25Gb/s, gold-nickel-copper alloy reed contacts, Telcordia GR-1217-CORE compliant socket.
| Characteristic | Advantage | |||
| Signal integrity data rate up to 25Gb/s, plans to upgrade to 50 + Gb/s in the future | Compact package for excellent performance | |||
| Traditional connector material structure | Guarantee long-term connector performance, contact retention and durability | |||
| Solderless socket termination | Eliminates thermal stress on soldering socket products, allowing for field equipment upgrades | |||
| Patented contact retention technology | Good contact retention | |||
| The housing can be actively stopped when the contact is offset | Provides contact protection against overstress and superior shock and vibration resistance | |||
| Custom and standard molded outer frames | Flexible design according to specific application requirements, or standard frames can be used for cost-effective solutions | |||
| Optional standard housing | Provide customized packaging solutions with low processing costs | |||
| Open pin area design offers differential pair, single-ended, and power contact configurations | Flexible density configuration to support a wide range of applications | |||
| Material number/model (part): | ||||
| 10307-001 | 7170-020 | 7500-103 | 7721-001 | 8448-001 |
| 13465-001 | 7281-001 | 7504-001 | 7886-003 | 8810-001 |
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