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Advantages of gold-plated connectors

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Specializing in the sales of: Connectors | Wire Harness | Cable Products

With the development of the Internet of Things, in order to provide instant access to information and data, more and more devices are connected together. However, the effectiveness and reliability of all electrical devices largely depend on the quality of the connections, especially the coatings used for connectors or contacts. Correct plating is the key to ensure the stable operation of equipment, and improper plating will negatively affect the performance, practicality and durability of electrical equipment.

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Gold is an expensive metal that improves connector performance in a variety of electrical applications. The benefits of using gold plating are as follows: 1. Strong corrosion resistance. Compared with other metals, gold has very high oxidation resistance or corrosion resistance. Plating can be used as an effective oxidation and corrosion barrier if the connector's contacts are likely to be exposed to corrosive substances or conditions. Therefore, gold-plated connectors are the best choice for applications where connectors or contacts are exposed to more corrosive properties. Applications for gold plated joints include applications with high humidity environments or frequent thermal cycling and exposure to corrosive salts or acids. In more demanding applications, heavy gold deposits or double bonus deposits may be required, which requires sufficient gold to remove holes in the deposits in order to create an effective corrosion barrier. (David Asher). 2. High conductivity Besides copper and silver, gold is the third most conductive metal in the world. However, gold does not produce oxides or other compounds, so it maintains high electrical conductivity even when exposed to high temperatures or corrosive environments. Gold's high uniform conductivity ensures stable current flow at very low voltages, making it an excellent choice for electronic applications where millivolts transmit milliamps. 3. Enhance durability. Electroplating gold can create small amounts of nickel or cobalt and alloys, increasing hardness from pure gold (below 90 Knoop) to a maximum of 200 Knoop. This hardened gold ore is often referred to as light gold. When plated at sufficient thicknesses (above 50 uin) on electrolytic or electroless nickel plated substrates, hard gold can provide a durable coating for repeated connection cycles. Due to natural lubricity, hard gold is not prone to abrasion or abrasion. 4. Scalability. Because gold is a ductile metal, it is suitable for flexible connections and springs. Because of the ductility of gold, the coating is more likely to withstand multiple contact cycles. However, electroplating electrical connectors or springs requires proper base plate materials to allow the surface treatment to meet the design requirements. When plating flexible contacts or springs, it is generally recommended to use engineering nickel such as nickel and sulfamic acid as the gold-plated base plate. 5. Solderable layer electroplating is an excellent surface treatment for forming reliable solder joints. As long as a soft rosin auxiliary solvent is used, it can always be evenly wetted without activating acid. Can be plated on virtually any substrate, including stainless steel terminals or connectors, which can later be joined by soldering. Generally, only 0.00001-inch thin soft gold deposits per side are needed to create reliable solderable gold contacts, but heavy gold deposits can also be soldered. When soldered to the money deposited layer, the plating diffuses to the solder joint through the mechanism of solid diffusion. Because of this phenomenon, the weight of gold in solder joints must be taken care not to exceed three percent. Because this causes the braze itself to become brittle. Generally speaking, deposits smaller than 0.00005 inches on each side will have less than three percent gold weight of the solder joint, which is non-visa. Finally, gold is not magnetic. This is beneficial for situations where electromagnetic fields may cause interference. For example, gold plating may be applied to connectors used in medical instruments, such as scanners.

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